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 TECHNICAL DATA
IN74HCT126A
Quad 3-State Noninverting Buffers
High-Performance Silicon-Gate CMOS
The IN74HCT126A is identical in pinout to the LS/ALS126. The IN74HCT126A may be used as a level converter for interfacing TTL or NMOS outputs to High Speed CMOS inputs. The IN74HCT126A noninverting buffers are designed to be used with 3-state memory address drivers, clock drivers, and other bus-oriented systems. The devices have four separate output enables that are activehigh. * TTL/NMOS Compatible Input Levels * Outputs Directly Interface to CMOS, NMOS, and TTL * Operating Voltage Range: 4.5 to 5.5 V * Low Input Current: 1.0 A
ORDERING INFORMATION IN74HCT126AN Plastic IN74HCT126AD SOIC TA = -55 to 125 C for all packages
LOGIC DIAGRAM PIN ASSIGNMENT
FUNCTION TABLE
Inputs A PIN 14 =VCC PIN 7 = GND H L X OE H H L Output Y H L Z
X = don't care Z = high impedance
Rev. 00
IN74HCT126A
MAXIMUM RATINGS*
Symbol VCC VIN VOUT IIN IOUT ICC PD Tstg TL
*
Parameter DC Supply Voltage (Referenced to GND) DC Input Voltage (Referenced to GND) DC Output Voltage (Referenced to GND) DC Input Current, per Pin DC Output Current, per Pin DC Supply Current, VCC and GND Pins Power Dissipation in Still Air, Plastic DIP+ SOIC Package+ Storage Temperature Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP or SOIC Package)
Value -0.5 to +7.0 -1.5 to VCC +1.5 -0.5 to VCC +0.5 20 35 75 750 500 -65 to +150 260
Unit V V V mA mA mA mW C C
Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. +Derating - Plastic DIP: - 10 mW/C from 65 to 125C SOIC Package: : - 7 mW/C from 65 to 125C
RECOMMENDED OPERATING CONDITIONS
Symbol VCC VIN, VOUT TA tr, tf Parameter DC Supply Voltage (Referenced to GND) DC Input Voltage, Output Voltage (Referenced to GND) Operating Temperature, All Package Types Input Rise and Fall Time (Figure 1) Min 4.5 0 -55 0 Max 5.5 VCC +125 500 Unit V V C ns
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, VIN and VOUT should be constrained to the range GND(VIN or VOUT)VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open.
Rev. 00
IN74HCT126A
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
VCC Symbol Parameter Test Conditions V Guaranteed Limit 25 C to -55C 2.0 2.0 0.8 0.8 4.4 5.4 3.98 0.1 0.1 0.26 0.1 0.5 85 C 2.0 2.0 0.8 0.8 4.4 5.4 3.84 0.1 0.1 0.33 1.0 5.0 125 C 2.0 2.0 0.8 0.8 4.4 5.4 3.7 0.1 0.1 0.4 1.0 10 A A V Unit
VIH VIL VOH
Minimum HighLevel Input Voltage Maximum Low Level Input Voltage Minimum HighLevel Output Voltage
VOUT= VCC-0.1 V IOUT 20 A VOUT=0.1 V IOUT 20 A VIN=VIH IOUT 20 A VIN=VIH IOUT 6.0 mA
4.5 5.5 4.5 5.5 4.5 5.5 4.5 4.5 5.5 4.5 5.5 5.5
V V V
VOL
Maximum LowLevel Output Voltage
VIN=VIL IOUT 20 A VIN=VIL IOUT 6.0 mA
IIN IOZ
Maximum Input Leakage Current Maximum ThreeState Leakage Current Maximum Quiescent Supply Current (per Package) Additional Quiescent Supply Current
VIN=VCC or GND Output in High-Impedance State VIN=VIL or VIH VOUT=VCC or GND VIN=VCC or GND IOUT=0A VIN = 2.4 V, Any One Input VIN=VCC or GND, Other Inputs IOUT=0A
ICC
5.5
8.0
80
160
A
ICC
-55C
25C to 125C 2.4
mA
5.5
2.9
Rev. 00
IN74HCT126A
AC ELECTRICAL CHARACTERISTICS (VCC=5.0 V 10%, CL=50pF,Input tr=tf=6.0 ns)
Guaranteed Limit Symbol Parameter 25 C to -55C 23 32 22 12 10 15 85C 125C Unit
tPLH, tPHL tPLZ, tPHZ tPZL, tPZH tTLH, tTHL CIN COUT
Maximum Propagation Delay, Input A to Output Y (Figures 1 and 3) Maximum Propagation Delay, Output Enable toY (Figures 2 and 4) Maximum Propagation Delay, Output Enable toY (Figures 2 and 4) Maximum Output Transition Time, Any Output (Figures 1 and 3) Maximum Input Capacitance Maximum Three-State Output Capacitance (Output in High-Impedance State) Power Dissipation Capacitance (Per Buffer)
30 38 28 15 10 15
35 48 34 18 10 15
ns ns ns ns pF pF
Typical @25C,VCC=5.0 V 55 pF
CPD
Used to determine the no-load dynamic power consumption: PD=CPDVCC2f+ICCVCC
Figure 1. Switching Waveforms
Figure 2. Switching Waveforms
Rev. 00
IN74HCT126A
Figure 3. Test Circuit
Figure 4. Test Circuit
EXPANDED LOGIC DIAGRAM
(1/4 of the Device)
Rev. 00
IN74HCT126A
N SUFFIX PLASTIC DIP (MS - 001AA)
A 14 8 B 1 7
Dimension, mm Symbol A B C MIN 18.67 6.1 MAX 19.69 7.11 5.33 0.36 1.14 2.54 7.62 0 2.92 7.62 0.2 0.38 10 3.81 8.26 0.36 0.56 1.78
F
L
D F
C -T- SEATING N G D 0.25 (0.010) M T K
PLANE
G H
H J
M
J K L M N
NOTES: 1. Dimensions "A", "B" do not include mold flash or protrusions. Maximum mold flash or protrusions 0.25 mm (0.010) per side.
D SUFFIX SOIC (MS - 012AB) Dimension, mm
8
A 14
Symbol A
MIN 8.55 3.8 1.35 0.33 0.4 1.27 5.27 0 0.1 0.19 5.8 0.25
MAX 8.75 4 1.75 0.51 1.27
H
B
P
B C
1
G
7 C R x 45
D F G
-TD 0.25 (0.010) M T C M K
SEATING PLANE
H
J F M
J K M P R
8 0.25 0.25 6.2 0.5
NOTES: 1. Dimensions A and B do not include mold flash or protrusion. 2. Maximum mold flash or protrusion 0.15 mm (0.006) per side for A; for B 0.25 mm (0.010) per side.
Rev. 00


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